| 1. | Packaging - paper and paperboard packaging - design of cartons
包装.纸和纸板包装.纸板箱的设计 |
| 2. | Packaging - paper and paperboard packaging - design of cartons
包装.纸和纸板包装.纸板箱的设计 |
| 3. | Packaging - paper and paperboard packaging - design of cartons ; german version en 14054 : 2003
包装.纸和纸板包装.纸板箱的设计 |
| 4. | Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitchball grid array
半导体器件机械标准化.表面安装半导体器件封装外形图绘制的一般规则.小螺距球栅阵列的设计指南 |
| 5. | Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for gull - wing lead terminals
半导体器件的机械标准化.表面安装的半导体器件封装外形图绘制的一般规则.海鸥翼式铅端子的设计指南 |
| 6. | Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack
半导体器件的机械标准化.表面安装半导体器件封装外形图绘制一般规则.玻璃密封陶瓷方型扁平封装设计指南 |
| 7. | Flga . mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitch land grid array - rectangular type
半导体装置的机械标准化.表面安装的半导体器件封装图形图绘制的一般规则.细微间距栅级阵列 |
| 8. | Mechanical standardization of semiconductor devices - part 6 - 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine pitch land grid array
半导体器件的机械标准化.第6 - 6部分:半导体器件包装用表面安装略图制备的一般规则.小螺距刃片栅格排列的设计指南 |
| 9. | Mechanical standardization of semiconductor devices - part 6 - 5 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitch ball grid array
半导体器件的机械标准化.第6 - 5部分:半导体器件包装用表面安装略图制备的一般规则.小螺距球面栅格排列的设计指南 |
| 10. | Mechanical standardization of semiconductor devices - part 6 - 12 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitch grid array - rectangular type
半导体装置的机械标准化.第6 - 12部分:表面安装半导体装置外形图绘制的一般规则.小节距栅极矩阵列的设计指南.矩形 |
