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Home > chinese-english > "倒装芯片隆起焊盘" in English

English translation for "倒装芯片隆起焊盘"

flip chip bump

Related Translations:
倒装接头:  flipped tab
倒装否定:  inverting negative
倒装置:  focusing devicefocusing mechanism
倒装语序:  inverted word-order
倒装片:  flip-chip
货物倒装:  overstowagetransfer of load
倒装焊:  fcb flichibonding
倒装焊接:  face down bondingflip chip bonding
倒装模:  inverted moldinverted mould
倒装法:  anastrophenflip chip approachflip chip methodflip-chiphyperbatonu ide-down method of hull section co tructionup-side-down mountingupside-down method of hull section construction
Similar Words:
"倒装小齿轮 逆向导叶" English translation, "倒装卸扣" English translation, "倒装芯片" English translation, "倒装芯片附着" English translation, "倒装芯片集成电路" English translation, "倒装芯片贴装" English translation, "倒装芯片贴装,倒装芯片附着" English translation, "倒装芯片座" English translation, "倒装语序" English translation, "倒装置" English translation