| 1. | Detail specification for electronic component . semiconductor integrated circuit . type ch2022 4 - bit shift register
电子元器件详细规范.半导体集成电路ch2022型4位移位寄存器 |
| 2. | Detail specification for electronic component . semiconductor integrated circuit - cc4014 cmos 8 - bit shift register
电子元器件详细规范.半导体集成电路cc4014型cmos8位移位寄存器 |
| 3. | By default , the compiler uses the coprocessor s 80 - bit registers to hold the intermediate results of floating - point calculations
默认情况下，编译器使用协处理器的80位寄存器保存浮点计算的中间结果。 |
| 4. | Most implementations have provided a 64 - bit timebase that is readable via two 32 - bit registers or a single 64 - bit register
大部分实现都提供了一个64位时基，可以通过两个32位寄存器读取，或者通过一个64位寄存器读取。 |
| 5. | Detail specification for electronic components . semiconductor integrated circuit ct54ls195 ct74ls195 4 - bit parallel - access shift register
电子元器件详细规范.半导体集成电路ct54ls195 ct74ls195型4位移位寄存器并行存取 |
| 6. | Detail specification for electronic components . semiconductor integrated circuit ct54195 ct74195 4 - bit parallel - access shift register
电子元器件详细规范.半导体集成电路ct54195 ct74195型4位移位寄存器并行存取， j - k输入 |
| 7. | Pmosfets and two 16 - bits shift registers were used as the impedance converting and address selection of the elements respectively . the thermal insulation layer was a polyimide film of five micrometers an
用pmos场效应管作热释电元件的阻抗转换，用双16位移位寄存器作敏感元件信号读出的选址。 |
| 8. | The research orientation and architecture of this thesis are also described . chapter 2 elaborates the basic design ideas , architecture and functions of vvp platform after analyzing the current implementation formats of vxi multi - functional instrument modules and multi - dsp parallel processing modules
第二章系统地介绍了模块化、支持多dsp并行扩展的32位寄存器基“ vxi多用途插板式硬件平台( vxiversatileplug - inplatform ， vvp ) ” 。 |
